Tailored for different packaging requirements, we provide complete high-temperature and low-temperature solder material solutions. Balancing high thermal resistance and low-stress packaging needs, our materials are widely used in automotive electronics, power modules, and advanced packaging, helping customers achieve optimal performance and reliability.

We offer a wide range of solder materials, including solder paste, solder wire, and solder balls, suitable for reflow soldering, wave soldering, and BGA / flip-chip packaging processes. Through stable alloy composition and precise particle size control, we ensure consistent soldering performance and reliable mass production.